Vertical Probe Cards are the top choice for chips with a small pitch and high pad density, such as Flip-Chip and WLCSP (Wafer Level Chip Scale Package). They stand out with impressive specifications: pad sizes as small as 45μ, a minimum pitch of 60μ, and low BCF (1-3g per probe). The probe tips are made from durable materials like typical Paliney7 and come in various shapes (flat, pointed) to suit the pad surface. Their complex structure consists of multiple layers (stiffener, PCB, mounting ring, dies, spacer, probes), requiring an extremely precise fabrication process to achieve alignment and planarity tolerances in the mil range (+/-0.3 and +/-0.6 mil).
Conversely, Pogo Spring Pin Probe Cards are often preferred for applications with a larger pitch and high current requirements. With a simpler yet durable and easy-to-maintain structure, they are ideal for power chips and certain Flip-Chip lines. Additionally, there are other build types like COBRA and Buckling Beam, each with its own advantages regarding cost-per-test and architecture.
The diversity of probe card types helps the semiconductor industry consistently meet the increasingly high and complex testing demands of new-generation chips.
