Testprobe We support selling offer the cantilever and vertical probe cards with various probe including WRe, CIS , Cobra, hbc, Bc,… for wafer yield testing. In order to meet customer’s various DUT materials and electrical specifications, we design suitable needle gauges, mechanisms and PCBs, and use engineering simulation to verify signal integrity and transmission speed, reduce noise interference, and ensure that we provide probe cards that meet customer quality
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Connecting manufacturers and customers brings reasonable costs
Before leaving our facility, every product undergoes stringent quality control. We conduct in-house testing for stable Contact Resistance (CRES), leakage, bandwidth limits, and mechanical durability under specified operating temperatures (-40°C to +155°C). The fully verified and validated equipment is then securely packaged and shipped to your location.
We begin by understanding your specific testing requirements. Whether you need a custom-built Probe Card (Vertical or Pogo Spring Pin for Multi-DUT testing), a complex Multi-layer PCB design, or maintenance and reverse engineering for your existing equipment, our team collects all necessary technical specifications (pitch, current, frequency, and application type).
Our engineering experts analyze your data to determine the optimal approach. For new projects, we select the best build type (COBRA, Buckling Beam, Pogo Pin) and PCB architecture. For legacy equipment, we perform thorough reverse engineering. We then present a comprehensive proposal, including technical solutions, cost estimates, and a fast-track timeline.
Our R&D team develops precise schematics and custom layouts. We focus heavily on addressing current market trends, ensuring superior alignment, planarity tolerance, and optimal signal integrity. The complete design is then submitted to you for review, feedback, and final sign-off to guarantee perfect integration with your systems.
Once approved, the project moves into our state-of-the-art manufacturing facility. This phase covers high-density PCB fabrication (including micro via plating), precise component assembly, and the integration of replaceable individual probes. Whether building from scratch or upgrading existing hardware, we execute with precision to meet our highly competitive delivery times (as fast as 2 weeks).
新闻资讯
Sep 18,2026
In the semiconductor manufacturing process, the Probe Card is an indispensable "interface" for connecting and verifying chip functionality on a wafer. There are various probe card technologies, each optimally designed for specific applications and chip characteristics. Understanding these types is the key to selecting an effective testing solution.
Sep 18,2026
When it comes to Probe Cards, we often focus on the test probes, but in reality, an equally important component—and often the biggest technical hurdle—is the specialized printed circuit board (PCB) connecting the probes to the testing system. PCB design for probe cards requires a high level of electrical and manufacturing expertise, directly impacting Signal Integrity.
Sep 18,2026
The semiconductor industry is experiencing unprecedented growth, demanding faster, more accurate, and more efficient chip testing processes. To meet this demand, test equipment technologies (probe cards) are witnessing remarkable improvements.
