Wafer-Level Test Interface Authority
20μm Precision. Total Integrity.
•Test Probe Co., Ltd delivers high quality
Cantilever/ Epoxy Probe Cards that average a
higher number of “touchdowns” ( 1million).
•Fromsingle tomulti-die configurations, Test Probe consistently delivers high probe count( up to 2,000 probes ) Probe Cardswithin 7working days orless.
•100% of our probe card are tested on our stateof-the-art Probe CardAnalyzers and are guaranteed tomatch the X,Y coordinates supplied with our customer’s design input data.
TEST PROBE consistently delivers high quality Vertical Probe Cards that average a higher number of “touchdowns” (>500,000)
•The benefitto our customers are significantly reducedwafertest costs
•TEST PROBE Co., Ltd provides Cobra Vertical Probe Cards.Our Probe Cards provide the following advantages:
•Easy maintenance
•Longerlife span (Use 14.5~15 Mils Tip length)
•Fastlead-time: 3weeks for newbuild and 1 week forrebuild ( change probes )
•Minimumpitch down to 60 µm
•Test Temperatures from-40 °C to +155 °C
POGO SPRING PIN PROBE CARD
| Specification | Detail |
| Bump Type | Eutectic or Pb-Free Solder or Cu Pillar |
| Applicable Pitch | 200μm or above |
| Tip Extension | Customized as requested |
| Max OT | Customized as requested |
| Tip Depth (from Wafer Side) | Customized as requested (+/-10mil) |
| Balanced Contact Force | Min 0.5g/mil (+/-20%) |
| Operating Temperature | -40°C to 125°C |
| Spring Pin Tips | Hardened Be-Cu / Au |
| Self Inductance | 0.56nH |
| Bandwidth | Up to 15 GHz @ -3dB |
| Contact Resistance | 100mOhm |
| Current Rating | Up to 2A |
