Wafer-Level Test Interface Authority
20μm Precision. Total Integrity.
TEST PROBE consistently delivers high quality Vertical Probe Cards that average a higher number of “touchdowns” (>500,000)
•The benefitto our customers are significantly reducedwafertest costs
•TEST PROBE Co., Ltd provides Cobra Vertical Probe Cards.Our Probe Cards provide the following advantages:
•Easy maintenance
•Longerlife span (Use 14.5~15 Mils Tip length)
•Fastlead-time: 3weeks for newbuild and 1 week forrebuild ( change probes )
•Minimumpitch down to 60 µm
•Test Temperatures from-40 °C to +155 °C
VERTICAL PROBE CARD
Capabilities
Multi-DUT up to 160 dies with 10x16 configuration
Diagonal configuration
Flip chip/bump/WLCSP applications
Configurations
8 Sites (2x4 Configuration)
16 Sites (2x8 Configuration)
Specifications
Pad Size: 45μ x 45μ
Probe Quantity: >5000
Minimum Pitch: 60μ
BCF: 1-3 Grams per probe
Flat Tip Diameter: 4, 3, 2 and 1.5 mils
Pointed Tip Diameter: 10 to 20μm
Tip Material: Typical Paliney7
Alignment Tolerance: +/-0.3 mil
Planarity Tolerance: +/-0.6 mil
Planarity Window: 1.2 mils
Over Travel: 3 mils Typical after last touch
Operating Temperature: -40°C to +155°C
Test Frequency: <70MHz (Wired) / >70MHz (Direct Mount)
Maximum Current: 0.5 A
In-line Resistance: 3.0 Ω maximum
Leakage: 10nA under 10V
Build Type: COBRA, BUCKLING BEAM AND POGO PIN
VERTICAL PROBE CARD Vertical Probe Structure
STIFFENER
P.C.BOARD
SCREW
MICRO VIA PLATING
MOUNTING RING
UPPER DIE
SPACER
LOWER DIE
PROBE
•Test Probe Co., Ltd delivers high quality
Cantilever/ Epoxy Probe Cards that average a
higher number of “touchdowns” ( 1million).
•Fromsingle tomulti-die configurations, Test Probe consistently delivers high probe count( up to 2,000 probes ) Probe Cardswithin 7working days orless.
•100% of our probe card are tested on our stateof-the-art Probe CardAnalyzers and are guaranteed tomatch the X,Y coordinates supplied with our customer’s design input data.
POGO SPRING PIN PROBE CARD
| Specification | Detail |
| Bump Type | Eutectic or Pb-Free Solder or Cu Pillar |
| Applicable Pitch | 200μm or above |
| Tip Extension | Customized as requested |
| Max OT | Customized as requested |
| Tip Depth (from Wafer Side) | Customized as requested (+/-10mil) |
| Balanced Contact Force | Min 0.5g/mil (+/-20%) |
| Operating Temperature | -40°C to 125°C |
| Spring Pin Tips | Hardened Be-Cu / Au |
| Self Inductance | 0.56nH |
| Bandwidth | Up to 15 GHz @ -3dB |
| Contact Resistance | 100mOhm |
| Current Rating | Up to 2A |
